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 College of Science & Engineering  

MURI — Roll-to-Roll Printed Electronics

Multi-University Research Initiative. Target application: Wireless brain-machine interface

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Roll-to-roll Manufacturing


A key objective of the MURI team is to assemble an integrated, roll-to-roll (R2R) manufacturing facility for producing high-density integrated circuits. Research results from earlier tasks will determine the design of this facility; here, we provide general ideas for layout and features based on the proposed process flow diagram in the figure below.

The three stages in the process flow are: A) roll-based processes that result in a polyimide substrate with recessed gates and interconnects, B) nozzle-based printing processes that create the remainder of the transistors – dielectric, semiconductors, source and drain electrodes, and other components, and C) roll-based processes that create the upper level interconnects.While creating a single R2R line that performs each stage in sequence has advantages, differences in process speeds between stages and space limitations in our academic setting have led us to an alternative facility layout.

We will construct three R2R pilot lines A, B, and C, corresponding to the process stages; schemes of these lines are shown in the figure. The lines will be built in the CPV Lab at the University of Minnesota, making use of the experience of Lab Manager Wieslaw Suszynski and the facility’s connections with industrial partners. These lines will be based on 4” wide polyimide substrates.

Semiconductor Inks, Mark Hersam Group, Northwestern University

Web moving machinery at the University of Minnesota Printing and Patterned Coatings Lab.